Invention Grant
US09321105B2 Clay-like composition for forming sintered copper body, powder for clay-like composition for forming sintered copper body, method of manufacturing clay-like composition for forming sintered copper body, sintered copper body, and method of manufacturing sintered copper body
有权
用于形成烧结铜体的粘土组合物，用于形成烧结铜体的粘土状组合物粉末，用于形成烧结铜体的粘土状组合物的制造方法，烧结铜体以及烧结铜体的制造方法
- Patent Title: Clay-like composition for forming sintered copper body, powder for clay-like composition for forming sintered copper body, method of manufacturing clay-like composition for forming sintered copper body, sintered copper body, and method of manufacturing sintered copper body
- Patent Title (中): 用于形成烧结铜体的粘土组合物，用于形成烧结铜体的粘土状组合物粉末，用于形成烧结铜体的粘土状组合物的制造方法，烧结铜体以及烧结铜体的制造方法
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Application No.: US13298515Application Date: 2011-11-17
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Publication No.: US09321105B2Publication Date: 2016-04-26
- Inventor: Takashi Yamaji , Yoshifumi Yamamoto , Yasuo Ido , Shinji Otani
- Applicant: Takashi Yamaji , Yoshifumi Yamamoto , Yasuo Ido , Shinji Otani
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2010-257850 20101118; JP2011-226902 20111014
- Main IPC: B22F3/10
- IPC: B22F3/10 ; C22C32/00
Abstract:
A clay-like composition for forming a sintered copper body of the present invention includes a powder constituent containing a copper-containing metal powder which contains copper and a copper-containing oxide powder which contains copper; a binder; and water, wherein the amount of oxygen contained in the powder constituent is in a range of from 4 mass % to 8 mass %.
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