Invention Grant
US09321120B2 Plasma cutting method and system 有权
等离子切割方法和系统

Plasma cutting method and system
Abstract:
A plasma cutting system for measuring or monitoring the voltage between a plasma torch and the material being cut to determine a voltage or voltage signature and comparing that measurement against predetermined values to indicate that an initial pierce of the material is complete, and based on the measurement, moving the torch or the material to a different location for additional cutting.
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