Invention Grant
- Patent Title: Plasma cutting method and system
- Patent Title (中): 等离子切割方法和系统
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Application No.: US13907668Application Date: 2013-05-31
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Publication No.: US09321120B2Publication Date: 2016-04-26
- Inventor: Daniel L. Wood , Ronald K. Worth
- Applicant: Daniel L. Wood , Ronald K. Worth
- Agency: Dykema Gossett PLLC
- Agent Jeffrey A. Pine
- Main IPC: B23K10/00
- IPC: B23K10/00

Abstract:
A plasma cutting system for measuring or monitoring the voltage between a plasma torch and the material being cut to determine a voltage or voltage signature and comparing that measurement against predetermined values to indicate that an initial pierce of the material is complete, and based on the measurement, moving the torch or the material to a different location for additional cutting.
Public/Granted literature
- US20130319978A1 Plasma Cutting Method and System Public/Granted day:2013-12-05
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