A method for thermally processing and curing unprocessed components within a thermal processing and consolidation system which includes upper and lower chamber assemblies configured to couple to one another and a first tool, the method including positioning the first tool on the lower chamber assembly moving the lower chamber assembly relative to the upper chamber assembly and coupling the upper chamber assembly and the lower chamber assembly to form a plenum, thereby completely enclosing the first tool in the plenum, the plenum operable to maintain a pressurized and/or temperature controlled environment about the first tool, providing services to the first tool and the plenum via a service interface, and thermally processing and curing the first set of unprocessed components within the first tool wherein the services are supplied to the first tool as directed by a set of process parameters.