Invention Grant
- Patent Title: Wiring substrate, droplet ejection head, printing apparatus, electronic device, and manufacturing method for wiring substrate
- Patent Title (中): 配线基板，液滴喷射头，印刷装置，电子装置及布线基板的制造方法
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Application No.: US14590832Application Date: 2015-01-06
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Publication No.: US09321261B2Publication Date: 2016-04-26
- Inventor: Masashi Yoshiike
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Maschoff Brennan
- Priority: JP2014-001430 20140108
- Main IPC: B41J2/04
- IPC: B41J2/04 ; B41J2/14 ; H05K1/18 ; H05K1/02 ; H05K3/02 ; B41J2/16
Abstract:
A wiring substrate includes a device substrate having a first surface, a sealing plate having a second surface superimposed on the first surface via an adhesive film and crossing the first surface, and wires set along the surfaces of the first surface, the adhesive film, and the second surface. The wiring substrate includes, between the wires adjacent to each other, a recessed section forming a recess with respect to a first bonding surface of the adhesive which is in contact with the first wire and a second bonding surface of the adhesive which is in contact with the second wire.
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