A liquid discharge head includes a recording element substrate comprising a semiconductor substrate having an pressure generating element configured to generate pressure for discharging liquid, on a first surface, a flow path forming member disposed on the first surface, and in which a discharge port configured to discharge the liquid and a liquid flow path in communication with the discharge port are formed, and a connection terminal disposed in a vicinity of an end portion of the first surface, and an electric wiring substrate electrically connected to the connection terminal. The recording element substrate includes an insulating resin layer disposed in a vicinity of the end portion of the first surface and outward from the connection terminal, and an adhesiveness improving layer disposed between the insulating resin layer and the semiconductor substrate, and configured to improve adhesiveness between the insulating resin layer and the semiconductor substrate.