A method for application of an anti-wetting coating to a substrate of a semiconductor material is described. The method includes applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and, optionally, at least one hetero-atom for obtaining a layer of hydrocarbons. The method also includes treating at least one surface of the substrate of the semiconductor material with an acid. The layer of hydrocarbons is transferred from the support to the surface of the substrate of the semiconductor material. The layer of hydrocarbons is chemically coupled with the surface of the substrate of the semiconductor material. The method may be applied to an integrated ink jet printhead provided with a nozzle plate in which the nozzle plate serves as the substrate of the semiconductor material.