An electronic device includes an accommodation space formed between a first base material and a second base material, and a first functional element and a second functional element in the accommodation space. The accommodation space is disposed in an internal region of a bonding portion that bonds the first base material and the second base material together. The bonding portion includes a first bonding region provided on one side thereof and a second bonding region provided on the other side thereof. The electronic device includes a first wiring portion which is electrically connected to the first functional element and has a first direction toward the outside of the accommodation space through the first bonding region, and a second wiring portion which is electrically connected to the second functional element and has a second direction toward the outside of the accommodation space through the second bonding region.