Invention Grant
- Patent Title: Socket type MEMS bonding
- Patent Title (中): 插座式MEMS接合
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Application No.: US14204472Application Date: 2014-03-11
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Publication No.: US09321632B2Publication Date: 2016-04-26
- Inventor: Ting-Hau Wu
- Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H01L23/02 ; H01L29/00 ; B81C1/00
Abstract:
A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate.
Public/Granted literature
- US20140193949A1 SOCKET TYPE MEMS BONDING Public/Granted day:2014-07-10
Information query
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