A luminous module comprising a plurality of radiation-emitting semiconductor components (2), a connection carrier (3), on which the radiation-emitting semiconductor components (2) are arranged, and a cooling body (6), which, on its front-side surface, is connected to the connection carrier (3) and has a basic body (4) and also a means (5), which is designed to locally alter the thermal resistance of the cooling body (6), wherein the average thermal resistance of the cooling body (6) decreases along a main extension direction of the luminous module (1).