A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity λ of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ε of the heat radiation layer is 0.7 or more.