Invention Grant
- Patent Title: Humidity control module and humidity control apparatus
- Patent Title (中): 湿度控制模块和湿度控制装置
-
Application No.: US14344819Application Date: 2012-09-14
-
Publication No.: US09322563B2Publication Date: 2016-04-26
- Inventor: Naotoshi Fujita , Shuji Ikegami
- Applicant: Naotoshi Fujita , Shuji Ikegami
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2011-203674 20110916
- International Application: PCT/JP2012/005901 WO 20120914
- International Announcement: WO2013/038708 WO 20130321
- Main IPC: F24F3/14
- IPC: F24F3/14 ; B01F3/04 ; F24F3/147 ; F28D21/00 ; F24F11/00

Abstract:
A humidity control module, in which liquid absorbent exchanges air and moisture, reduces a temperature change in the liquid absorbent. A humidity control module includes a partition member and a heat transfer member. The partition member separates an air passage from an absorbent passage. The partition member is wholly or partially formed by a moisture permeable membrane. The liquid absorbent flowing through the absorbent passage exchanges the moisture with the air flowing through the air passage via the moisture permeable membrane. The heat transfer member is provided in the absorbent passage and surrounded by the liquid absorbent. A heat medium flowing through the heat transfer member exchanges heat with the liquid absorbent flowing through the absorbent passage.
Public/Granted literature
- US20140374929A1 HUMIDITY CONTROL MODULE AND HUMIDITY CONTROL APPARATUS Public/Granted day:2014-12-25
Information query