Invention Grant
- Patent Title: Apparatus and method for 3D surface measurement
- Patent Title (中): 3D表面测量的装置和方法
-
Application No.: US14350359Application Date: 2012-10-17
-
Publication No.: US09322643B2Publication Date: 2016-04-26
- Inventor: Lei Huang , Chi Seng Ng , Hoe Jyh Koh , Anand Krishna Asundi
- Applicant: Nanyang Technological University
- Applicant Address: SG Singapore
- Assignee: NANYANG TECHNOLOGICAL UNIVERSITY
- Current Assignee: NANYANG TECHNOLOGICAL UNIVERSITY
- Current Assignee Address: SG Singapore
- International Application: PCT/SG2012/000386 WO 20121017
- International Announcement: WO2013/058710 WO 20130425
- Main IPC: G01B11/24
- IPC: G01B11/24 ; G01B11/25 ; G01B11/245 ; G01N21/88 ; G06T7/00

Abstract:
An apparatus for 3D surface measurement of a target surface, the apparatus comprising: a first projector configured to project a fringe pattern onto the target surface; a second projector configured to project a fringe pattern onto the target surface; a first camera configured to capture the fringe patterns projected by the first projector and the second projector; a second camera configured to capture the fringe patterns projected by the first projector and the second projector; and a computer configured to perform fringe pattern processing of the fringe patterns captured by the first camera and the second camera and to perform data stitching and merging to obtain a 3D surface reconstruction.
Public/Granted literature
- US20140253929A1 APPARATUS AND METHOD FOR 3D SURFACE MEASUREMENT Public/Granted day:2014-09-11
Information query