Invention Grant
- Patent Title: Optical module, and optical printed circuit board and method of manufacturing the same
- Patent Title (中): 光模块和光印刷电路板及其制造方法
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Application No.: US13144960Application Date: 2009-11-26
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Publication No.: US09323017B2Publication Date: 2016-04-26
- Inventor: Jae Bong Choi , Joon Wook Han
- Applicant: Jae Bong Choi , Joon Wook Han
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2009-0003715 20090116
- International Application: PCT/KR2009/007018 WO 20091126
- International Announcement: WO2010/082725 WO 20100722
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/43 ; G02B6/36 ; G02B6/42

Abstract:
Provided are an optical module, and an optical printed circuit board and a method of manufacturing the same. The optical module includes an optical fiber, a first ferrule coupled to one end of the optical fiber, and a second ferrule coupled to the other end of the optical fiber. The optical printed circuit board includes a first board, an optical transmitter module and an optical receiver module, which are disposed on the first board, an optical fiber passing through the first board, the optical fiber extending integrally from a lower side of the optical transmitter module to a lower side of the optical receiver module, first and second ferrules coupled to one end and the other end of the optical fiber, respectively, the first and second ferrules being supported by the first board, and a second board through which the optical fiber passes, the second board being disposed below the first board.
Public/Granted literature
- US20120002916A1 Optical Module, and Optical Printed Circuit Board and Method of Manufacturing the Same Public/Granted day:2012-01-05
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