Invention Grant
- Patent Title: Chemically amplified positive-type photosensitive resin composition and method for producing resist pattern using the same
- Patent Title (中): 化学放大型正型感光性树脂组合物及其制造方法
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Application No.: US14459742Application Date: 2014-08-14
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Publication No.: US09323152B2Publication Date: 2016-04-26
- Inventor: Makiko Irie
- Applicant: Tokyo Ohka Kogyo Co., Ltd.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD
- Current Assignee: TOKYO OHKA KOGYO CO., LTD
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson and Bear, LLP
- Priority: JP2013-173960 20130823
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/40 ; G03F7/039 ; G03F7/30 ; G03F7/027

Abstract:
A chemically amplified positive-type photosensitive resin composition including a compound represented by the following formula (1), having a melting point of 40° C. or lower at 1 atm, a resin whose solubility in alkali increases under the action of an acid, and a photoacid generator. In the formula, R1 represents a hydrogen atom or an organic group; and R2, R3, and R4 independently represent a monovalent hydrocarbon group which may have a substituent, and at least two of R2, R3, and R4 may be bonded to each other to form a cyclic structure.
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