Invention Grant
US09324380B2 Stacked semiconductor apparatus and semiconductor system capable of inputting signals through various paths
有权
能够通过各种路径输入信号的叠层半导体装置和半导体系统
- Patent Title: Stacked semiconductor apparatus and semiconductor system capable of inputting signals through various paths
- Patent Title (中): 能够通过各种路径输入信号的叠层半导体装置和半导体系统
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Application No.: US14329213Application Date: 2014-07-11
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Publication No.: US09324380B2Publication Date: 2016-04-26
- Inventor: Sang Jin Byeon , Jae Bum Ko , Young Jun Ku
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-Si
- Assignee: SK HYNIX INC.
- Current Assignee: SK HYNIX INC.
- Current Assignee Address: KR Icheon-Si
- Agency: William Park & Associates Ltd.
- Priority: KR10-2014-0027735 20140310
- Main IPC: G11C5/04
- IPC: G11C5/04 ; G11C29/12 ; G11C29/26 ; H01L25/18 ; H01L23/00 ; H01L25/065 ; G11C29/18 ; G11C7/10
Abstract:
A semiconductor apparatus includes a control signal reception portion. The control signal reception portion may set information related to operation of a memory chip by receiving a command signal and an address signal from one among a stack chip test portion, a control signal interface portion and a test setting portion.
Public/Granted literature
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