Invention Grant
- Patent Title: Dispersion for the metallization of contactings
- Patent Title (中): 用于金属化接触的分散体
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Application No.: US14554971Application Date: 2014-11-26
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Publication No.: US09324474B2Publication Date: 2016-04-26
- Inventor: Heribert Weber , Yvonne Bergmann , Klaus Krueger , Andreas Rathjen
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: ROBERT BOSCH GMBH
- Current Assignee: ROBERT BOSCH GMBH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102013224622 20131129
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C09D11/322 ; H05K1/09 ; H05K3/40 ; C09D11/52 ; H01L21/283 ; H05K3/12
Abstract:
A dispersion is provided having a dispersion medium and a plurality of colloid particles finely distributed in the dispersion medium, the colloid particles being electrically conductive, the dispersion being a functional ink for the wetting of an inner wall of a contacting opening of a substrate using a print process.
Public/Granted literature
- US20150151328A1 dispersion for the metallization of contactings Public/Granted day:2015-06-04
Information query
