Invention Grant
- Patent Title: Solenoid assembly
- Patent Title (中): 电磁阀总成
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Application No.: US14486455Application Date: 2014-09-15
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Publication No.: US09324488B2Publication Date: 2016-04-26
- Inventor: Robert A. Dayton
- Applicant: Eaton Corporation
- Applicant Address: US OH Cleveland
- Assignee: Eaton Corporation
- Current Assignee: Eaton Corporation
- Current Assignee Address: US OH Cleveland
- Agency: Quinn Law Group, PLLC
- Main IPC: H01F3/00
- IPC: H01F3/00 ; H01F7/08 ; H01F7/18 ; H01F7/16 ; H01F7/126 ; H01F7/128 ; H01F7/06

Abstract:
A solenoid assembly includes a coil assembly having a coil and a bobbin surrounding the coil. A first post extends from the bobbin. Electrical current is supplied to the coil through the first post. An armature at least partially surrounds the coil assembly and is configured so that the first post extends through the armature. The armature is configured to translate relative to the pole piece when the coil is energized. A feature is configured to prevent the armature from contacting the first post when the armature translates.
Public/Granted literature
- US20150061799A1 SOLENOID ASSEMBLY WITH ANTI-HYSTERESIS FEATURE Public/Granted day:2015-03-05
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