Invention Grant
US09324586B2 Chip-packaging module for a chip and a method for forming a chip-packaging module
有权
用于芯片的芯片封装模块和用于形成芯片封装模块的方法
- Patent Title: Chip-packaging module for a chip and a method for forming a chip-packaging module
- Patent Title (中): 用于芯片的芯片封装模块和用于形成芯片封装模块的方法
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Application No.: US13211408Application Date: 2011-08-17
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Publication No.: US09324586B2Publication Date: 2016-04-26
- Inventor: Horst Theuss
- Applicant: Horst Theuss
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
A chip-packaging module for a chip is provided, the chip-packaging module including a chip including a first chip side, wherein the first chip side includes an input portion configured to receive a signal; a chip carrier configured to be in electrical connection with the first chip side, wherein the chip is mounted to the chip carrier via the first chip side; and a mold material configured to cover the chip on at least the first chip side, wherein at least part of the input portion is released from the mold material.
Public/Granted literature
- US20130043575A1 CHIP-PACKAGING MODULE FOR A CHIP AND A METHOD FOR FORMING A CHIP-PACKAGING MODULE Public/Granted day:2013-02-21
Information query
IPC分类:
