Invention Grant
- Patent Title: Integrated circuit packaging system with external interconnect and method of manufacture thereof
- Patent Title (中): 具有外部互连的集成电路封装系统及其制造方法
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Application No.: US13425286Application Date: 2012-03-20
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Publication No.: US09324641B2Publication Date: 2016-04-26
- Inventor: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/498
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a routable distribution layer on a leadframe; mounting an integrated circuit over the routable distribution layer; encapsulating with an encapsulation over the routable distribution layer; peeling the leadframe away from the routable distribution layer with a bottom distribution side of the routable distribution layer exposed from the encapsulation; and mounting an external interconnect on the routable distribution layer.
Public/Granted literature
- US20130249068A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXTERNAL INTERCONNECT AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-09-26
Information query
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