Invention Grant
- Patent Title: Semiconductor device including a plurality of magnetic shields
- Patent Title (中): 半导体器件包括多个磁屏蔽
-
Application No.: US14273177Application Date: 2014-05-08
-
Publication No.: US09324663B2Publication Date: 2016-04-26
- Inventor: Takahito Watanabe , Shintaro Yamamichi , Yoshitaka Ushiyama
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-255088 20101115
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L29/82 ; H01L23/34 ; H01L23/48 ; H01L23/58 ; H01L23/13 ; H01L27/22 ; H01L23/31 ; H01L23/498 ; H01L23/00
Abstract:
A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, a side surface arranged between the first main surface and the second main surface, and a magnetic storage device, a first magnetic shield overlaying on the first main surface, a second magnetic shield overlaying on the second main surface, and a third magnetic shield overlaying on the side surface. The first and second magnetic shields are mechanically connected via the third magnetic shield.
Public/Granted literature
- US20140239425A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2014-08-28
Information query
IPC分类:
