Invention Grant
- Patent Title: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
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Application No.: US14558184Application Date: 2014-12-02
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Publication No.: US09324676B2Publication Date: 2016-04-26
- Inventor: See Hiong Leow , Liang Chee Tay
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: SG200608455-2 20061204
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L23/00 ; H01L21/56 ; H01L21/683 ; H01L25/065 ; H01L25/00 ; H01L25/04 ; H01L23/31
Abstract:
Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a stand-off layer over a plurality of microelectronic dies on a semiconductor workpiece, and removing selected portions of the stand-off layer to form a plurality of stand-offs with the individual stand-offs positioned on a backside of a corresponding die. The method further includes cutting the semiconductor workpiece to singulate the dies, and attaching the stand-off on a first singulated die to a second die.
Public/Granted literature
- US20150130035A1 PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES Public/Granted day:2015-05-14
Information query
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