Invention Grant
US09324678B2 Low profile zero/low insertion force package top side flex cable connector architecture
有权
薄型零/低插入力封装顶端柔性电缆连接器架构
- Patent Title: Low profile zero/low insertion force package top side flex cable connector architecture
- Patent Title (中): 薄型零/低插入力封装顶端柔性电缆连接器架构
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Application No.: US13996498Application Date: 2011-12-20
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Publication No.: US09324678B2Publication Date: 2016-04-26
- Inventor: Sanka Ganesan , Ram S. Viswanath
- Applicant: Sanka Ganesan , Ram S. Viswanath
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- International Application: PCT/US2011/066288 WO 20111220
- International Announcement: WO2013/095402 WO 20130627
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/40 ; H01L23/00 ; H01R12/62 ; H05K3/36 ; H01L23/498 ; H01B7/04 ; H05K1/14
Abstract:
An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.
Public/Granted literature
- US20140217571A1 LOW PROFILE ZERO/LOW INSERTION FORCE PACKAGE TOP SIDE FLEX CABLE CONNECTOR ARCHITECTURE Public/Granted day:2014-08-07
Information query
IPC分类:
