Invention Grant
- Patent Title: Two-shaft drive mechanism and die bonder
- Patent Title (中): 双轴驱动机构和管芯接合器
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Application No.: US13587101Application Date: 2012-08-16
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Publication No.: US09324679B2Publication Date: 2016-04-26
- Inventor: Yoshihide Ishii , Masayuki Mochizuki , Yoshihiro Kurihara
- Applicant: Yoshihide Ishii , Masayuki Mochizuki , Yoshihiro Kurihara
- Applicant Address: JP Minami-Alps
- Assignee: Fasford Technology Co., Ltd.
- Current Assignee: Fasford Technology Co., Ltd.
- Current Assignee Address: JP Minami-Alps
- Agency: Crowell & Moring LLP
- Priority: JP2012-042896 20120229
- Main IPC: B29C65/48
- IPC: B29C65/48 ; H01L23/00

Abstract:
A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.
Public/Granted literature
- US20130221764A1 Two-Shaft Drive Mechanism and Die Bonder Public/Granted day:2013-08-29
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