In one embodiment, a semiconductor package includes a circuit substrate, a plurality of semiconductor chips stacked on the circuit substrate, insulating adhesive patterns interposed between the semiconductor chips, a heat slug provided on an uppermost semiconductor chip and adhered to the uppermost semiconductor chip by a heat dissipative adhesive pattern, and a mold structure provided on the circuit substrate to cover sidewalls of the semiconductor chips, the insulating adhesive patterns, the heat dissipative adhesive pattern and the heat slug. A failure of the semiconductor package during a manufacturing process of the mold structure may be reduced. The semiconductor package may therefore have good operating characteristics and reliability.