Invention Grant
- Patent Title: Chip-on-film (COF) tape and corresponding COF bonding method
- Patent Title (中): 片上胶片（COF）胶带和相应的COF粘合方法
-
Application No.: US14235808Application Date: 2013-11-27
-
Publication No.: US09324689B2Publication Date: 2016-04-26
- Inventor: Minghu Qi , Chun Hao Wu , Kun Hsien Lin , Yongqiang Wang , Zhiyou Shu , Weibing Yang , Zenghong Chen , Guokun Yang , Chenyangzi Li , Yunshao Jiang
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agent Mark M. Friedman
- Priority: CN201310593774 20131121
- International Application: PCT/CN2013/087891 WO 20131127
- International Announcement: WO2015/074283 WO 20150528
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065 ; G02F1/133 ; H01L23/538 ; G02F1/1345 ; H01L23/498 ; G02F1/13
Abstract:
The present invention provides a chip-on-film (COF) tape and a corresponding COF bonding method. The COF tape comprises a base tape, a plurality of first COFs and second COFs, the first and second COFs are arranged on the base tape in an alternating manner, and are correspondingly punched onto a moving platform by a punching mechanism, and are respectively bonded onto two side edges of a liquid crystal panel. The present invention can simultaneously process the bonding operations of the two types of COF by using only one COF tape and one set of equipment, thus lowering the cost and increasing the productivity.
Public/Granted literature
- US20150357308A1 CHIP-ON-FILM (COF) TAPE AND CORRESPONDING COF BONDING METHOD Public/Granted day:2015-12-10
Information query
IPC分类:
