Invention Grant
US09324713B1 Eliminating field oxide loss prior to FinFET source/drain epitaxial growth
有权
在FinFET源极/漏极外延生长之前消除场氧化物损失
- Patent Title: Eliminating field oxide loss prior to FinFET source/drain epitaxial growth
- Patent Title (中): 在FinFET源极/漏极外延生长之前消除场氧化物损失
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Application No.: US14658279Application Date: 2015-03-16
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Publication No.: US09324713B1Publication Date: 2016-04-26
- Inventor: Hong Yu , Bingwu Liu , Hui Zang , Lun Zhao
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/088 ; H01L29/66 ; H01L29/06 ; H01L21/311 ; H01L21/3105 ; H01L21/762 ; H01L21/8234 ; H01L29/78

Abstract:
Method for forming FinFET source/drain regions with reduced field oxide loss and the resulting devices are disclosed. Embodiments include forming silicon fins separated by a field oxide on a silicon substrate; recessing the field oxide to reveal an upper portion of the silicon fins; forming a spacer layer conformally over the upper portion of the fins and over the field oxide; filling spaces between the fins with a material having high selectivity with the spacer layer; recessing the material; removing the spacer layer above an upper surface of the material; removing the material; recessing the upper portion of the fins; and epitaxially growing source/drain regions on the recessed fins.
Information query
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