Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14179250Application Date: 2014-02-12
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Publication No.: US09324714B2Publication Date: 2016-04-26
- Inventor: Akira Hokazono , Masakazu Goto , Yoshiyuki Kondo
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2013-232490 20131108
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L27/092 ; H01L21/8238

Abstract:
In one embodiment, a semiconductor device includes a semiconductor substrate, and first and second transistors of first and second conductivity types on the substrate. The first transistor includes a first gate electrode on the substrate, a first source region of the second conductivity type and a first drain region of the first conductivity type disposed to sandwich the first gate electrode, and a first channel region of the first or second conductivity type disposed between the first source region and the first drain region. The second transistor includes a second gate electrode on the substrate, a second source region of the first conductivity type and a second drain region of the second conductivity type disposed to sandwich the second gate electrode, and a second channel region disposed between the second source region and the second drain region and having the same conductivity type as the first channel region.
Public/Granted literature
- US20150129960A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-05-14
Information query
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