Invention Grant
US09324746B2 Pixel circuit for global shutter of substrate stacked image sensor
有权
用于基板堆叠图像传感器的全局快门的像素电路
- Patent Title: Pixel circuit for global shutter of substrate stacked image sensor
- Patent Title (中): 用于基板堆叠图像传感器的全局快门的像素电路
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Application No.: US14497442Application Date: 2014-09-26
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Publication No.: US09324746B2Publication Date: 2016-04-26
- Inventor: Jin Eun Choi , Jae Won Uhm , Seung Hoon Sa
- Applicant: SiliconFile Technologies Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SILICONFILE TECHNOLOGIES INC.
- Current Assignee: SILICONFILE TECHNOLOGIES INC.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2013-0114388 20130926; KR10-2013-0135804 20131108
- Main IPC: H01L27/148
- IPC: H01L27/148 ; H01L29/768 ; H01L27/146
Abstract:
A pixel circuit for a global shutter of a substrate-stacked image sensor may include a semiconductor chip including: a photodiode configured to output electric charges generated through a light sensing operation; and a reset node configured to receive a reset voltage from a reset voltage node and reset the photodiode. The semiconductor chip may have a structure in which the semiconductor chip is stacked over another semiconductor chip.
Public/Granted literature
- US20150084098A1 PIXEL CIRCUIT FOR GLOBAL SHUTTER OF SUBSTRATE STACKED IMAGE SENSOR Public/Granted day:2015-03-26
Information query
IPC分类:
