Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14467146Application Date: 2014-08-25
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Publication No.: US09324787B2Publication Date: 2016-04-26
- Inventor: Chiharu Ota , Tatsuo Shimizu , Johji Nishio , Takashi Shinohe
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-182595 20130903
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/36 ; H01L29/861 ; H01L29/872 ; H01L29/16 ; H01L29/167 ; H01L29/66 ; H01L29/04

Abstract:
According to one embodiment, a semiconductor device includes a first semiconductor region, a second semiconductor region, a third semiconductor region, and a first electrode. The first semiconductor region is of a first conductivity type. The second semiconductor region is provided on the first semiconductor region, and is of a second conductivity type. The third semiconductor region is provided on the second semiconductor region, and is of the second conductivity type. The third semiconductor region contains a first impurity of the first conductivity type and a second impurity of the second conductivity type, and satisfies 1
Public/Granted literature
- US20150060884A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-03-05
Information query
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