Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14526113Application Date: 2014-10-28
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Publication No.: US09324788B2Publication Date: 2016-04-26
- Inventor: Akio Tamagawa , Makoto Tanaka
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-225789 20131030
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/088 ; H01L21/8234 ; H01L23/00

Abstract:
In a semiconductor device, a lightly doped second semiconductor layer of a first conductive type is joined with a heavily doped first semiconductor layer of the first conductive type. A power transistor having a first conductive type channel and a transistor are formed in surface regions of the second semiconductor layer, respectively. A first diffusion layer of a second conductive type is formed in a surface region of the second semiconductor layer to provide a boundary between the power transistor and the transistor. The first semiconductor layer functions as a drain of the power transistor. The first diffusion layer region is set to the same voltage as that of the drain.
Public/Granted literature
- US20150115359A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-04-30
Information query
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