Invention Grant
- Patent Title: Semiconductor device manufacturing method
-
Application No.: US14683203Application Date: 2015-04-10
-
Publication No.: US09324857B2Publication Date: 2016-04-26
- Inventor: Toshio Nakajima
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-170355 20110803
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L21/261 ; H01L21/263 ; H01L21/265 ; H01L29/10 ; H01L29/167

Abstract:
A semiconductor device includes a p-type semiconductor layer, n-type column regions formed of columnar thermal donors exhibiting an n-type property, a p-type column region interposed between the n-type column regions, the n-type column regions configured to form a super-junction structure in cooperation with the p-type column region, a channel region formed in the semiconductor layer, a source region formed in the channel region, a gate insulator film formed on the semiconductor layer, and a gate electrode formed on the gate insulator film and opposite to the channel region across the gate insulator film.
Public/Granted literature
- US20150221763A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2015-08-06
Information query
IPC分类: