Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
- Patent Title (中): 半导体器件结构及其形成方法
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Application No.: US14502430Application Date: 2014-09-30
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Publication No.: US09324864B2Publication Date: 2016-04-26
- Inventor: Chia-Yao Liang , Chen-Liang Liao , Ming Lei , Chih-Hsiao Chen , Yi-Lii Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/78 ; H01L29/45 ; H01L29/06 ; H01L27/088 ; H01L29/66 ; H01L21/8234

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes an isolation structure positioned in the semiconductor substrate and adjacent to a first active region of the semiconductor substrate. The semiconductor device structure includes a gate stack disposed over the first active region. The semiconductor device structure includes a first contact structure disposed over the first active region and positioned between the isolation structure and the gate stack. The semiconductor device structure includes a dummy gate stack disposed over the isolation structure and adjacent to the gate stack. The dummy gate stack is not positioned over a portion of the isolation structure next to the first contact structure.
Public/Granted literature
- US20160093736A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-03-31
Information query
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