Invention Grant
US09324868B2 Epitaxial growth of silicon for FinFETS with non-rectangular cross-sections
有权
具有非矩形横截面的FinFETS的外延生长
- Patent Title: Epitaxial growth of silicon for FinFETS with non-rectangular cross-sections
- Patent Title (中): 具有非矩形横截面的FinFETS的外延生长
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Application No.: US14463057Application Date: 2014-08-19
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Publication No.: US09324868B2Publication Date: 2016-04-26
- Inventor: Ran Ruby Yan , Ralf Richter , Jan Hoentschel , Hans-Jurgen Thees
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L29/78 ; H01L29/66 ; H01L21/762 ; H01L21/306 ; H01L21/02 ; H01L29/06

Abstract:
FinFET devices with epitaxially grown fins and methods for fabricating them are provided. Embodiments include forming at least two shallow trench isolation (STI) regions, filled with dielectric material, adjacent to but separate from each other in a silicon substrate; epitaxially growing a silicon-based layer between each adjacent pair of STI regions to form a fin with a non-rectangular cross-section extending from each STI region to each adjacent STI region; forming a gate oxide over and perpendicular to each fin; and forming a gate electrode over the gate oxide to form a FinFET.
Public/Granted literature
- US20160056294A1 EPITAXIAL GROWTH OF SILICON FOR FINFETS WITH NON-RECTANGULAR CROSS-SECTIONS Public/Granted day:2016-02-25
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