- Patent Title: Thermal management in electronic devices with yielding substrates
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Application No.: US14792701Application Date: 2015-07-07
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Publication No.: US09324930B2Publication Date: 2016-04-26
- Inventor: Michael A. Tischler
- Applicant: Michael A. Tischler
- Applicant Address: CA Richmond
- Assignee: Cooledge Lighting, Inc.
- Current Assignee: Cooledge Lighting, Inc.
- Current Assignee Address: CA Richmond
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L33/62 ; H01L23/00
Abstract:
In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
Public/Granted literature
- US20150333239A1 THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES Public/Granted day:2015-11-19
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