Invention Grant
- Patent Title: RF front end module and mobile wireless device
- Patent Title (中): 射频前端模块和移动无线设备
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Application No.: US14010019Application Date: 2013-08-26
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Publication No.: US09325042B2Publication Date: 2016-04-26
- Inventor: Hirotada Taniuchi , Hideaki Shoji , Takaki Kanno , Katsunori Ishimiya
- Applicant: SONY MOBILE COMMUNICATIONS INC.
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,SONY MOBILE COMMUNICATIONS INC.
- Current Assignee: Sony Corporation,SONY MOBILE COMMUNICATIONS INC.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H04B1/44
- IPC: H04B1/44 ; H01P1/10 ; H04B1/00 ; H04B1/525
Abstract:
A wireless communication module comprising including a first transmission bandpass filter that takes a first transmit frequency band as a passband; a second transmission bandpass filter that takes a second transmit frequency band as a passband; a first reception bandpass filter that takes a first receive frequency band as a passband; a second reception bandpass filter that takes a second receive frequency band as a passband; and a plurality of switches, each switch connected to a single one of the bandpass filters.
Public/Granted literature
- US20140073268A1 RF FRONT END MODULE AND MOBILE WIRELESS DEVICE Public/Granted day:2014-03-13
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