Invention Grant
US09325060B2 Methods and apparatus for conductive element deposition and formation
有权
用于导电元件沉积和形成的方法和装置
- Patent Title: Methods and apparatus for conductive element deposition and formation
- Patent Title (中): 用于导电元件沉积和形成的方法和装置
-
Application No.: US14620108Application Date: 2015-02-11
-
Publication No.: US09325060B2Publication Date: 2016-04-26
- Inventor: Esa Kalistaja , Elli Galla , Dan Kuehler , Winthrop Childers
- Applicant: Pulse Finland OY
- Applicant Address: FI Oulunsalo
- Assignee: Pulse Finland OY
- Current Assignee: Pulse Finland OY
- Current Assignee Address: FI Oulunsalo
- Agency: Gazdzinski & Associates PC
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H05K3/32 ; H01Q1/38 ; H05K3/12

Abstract:
A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a “thick” antenna element can be formed in one pass of a dispensing head or nozzle, thereby reducing manufacturing cost and increasing manufacturing efficiency.
Public/Granted literature
- US20150229025A1 METHODS AND APPARATUS FOR CONDUCTIVE ELEMENT DEPOSITION AND FORMATION Public/Granted day:2015-08-13
Information query