Invention Grant
- Patent Title: Antennae formed using integrated subarrays
- Patent Title (中): 使用集成子阵列形成天线
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Application No.: US13481663Application Date: 2012-05-25
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Publication No.: US09325075B1Publication Date: 2016-04-26
- Inventor: Lawrence K. Lam
- Applicant: Lawrence K. Lam
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: McDermott Will & Emery LLP
- Main IPC: H01Q13/10
- IPC: H01Q13/10

Abstract:
An antenna subarray is disclosed that includes a main board comprising a first substrate, a patterned conductive layer coupled to the first substrate, and a first antenna element coupled to the first substrate. The subarray also includes at least one ancillary board comprising a second substrate coupled to and extending outward from the first substrate and a second antenna element coupled to the second substrate and coupled through a soldered connection to the patterned conductive layer.
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