A portion of a flat conductor of a flat circuit board is exposed from an insulating layer covering at least one of surfaces of the flat conductor. A terminal includes a bottom plate on which the exposed portion of the flat conductor is provided, and crimp claws which are raised at two side edges of the bottom plate so that the exposed portion of the flat conductor is disposed therebetween. A spacer member is provided on the exposed portion of the flat conductor, and is configured to be plastically deformed so as to contact with inner surfaces of the crimp claws when the crimp claws are crimped onto the spacer member, thereby the terminal is crimped to the flat conductor in a state where the exposed portion of the flat conductor is in surface contact with the bottom plate.