Invention Grant
- Patent Title: Patch panel structure
- Patent Title (中): 配线架结构
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Application No.: US14475307Application Date: 2014-09-02
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Publication No.: US09325127B2Publication Date: 2016-04-26
- Inventor: Ying-Ming Ku , Wen-Fu Pon , Chun-Chieh Chen
- Applicant: YFC-BONEAGLE Electric Co., Ltd.
- Applicant Address: TW Taoyuan County
- Assignee: YFC-BONEAGLE ELECTRIC CO., LTD.
- Current Assignee: YFC-BONEAGLE ELECTRIC CO., LTD.
- Current Assignee Address: TW Taoyuan County
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01R24/64 ; H01R12/71

Abstract:
A patch panel structure includes a circuit board, a plurality of first RJ45 sockets, and a plurality of second RJ45 sockets. The circuit board has a first end and a second end opposite to each other. A plurality of first conducting points are formed at the first end. A plurality of second conducting points are formed at the second end. Each of the first RJ45 sockets forms a first interface and is electrically connected to each of the first conducting points. Each of the second RJ45 sockets forms a second interface, is electrically connected to each of the second conducting points, and is disposed in a parallel and symmetrical manner with respect to each of the first RJ45 sockets. Each of the first interfaces of the first RJ45 sockets is disposed in a back-to-back and spaced-apart manner with respect to each of the second RJ45 sockets.
Public/Granted literature
- US20160064878A1 PATCH PANEL STRUCTURE Public/Granted day:2016-03-03
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