Invention Grant
- Patent Title: Reducing inductive heating
- Patent Title (中): 减少感应加热
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Application No.: US13724672Application Date: 2012-12-21
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Publication No.: US09325183B2Publication Date: 2016-04-26
- Inventor: Juha Reinhold Backman
- Applicant: Nokia Corporation
- Applicant Address: FI Espoo
- Assignee: Nokia Technologies Oy
- Current Assignee: Nokia Technologies Oy
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H01F7/02 ; H01F41/02 ; H02J7/02 ; H01F27/38 ; H01F38/14 ; H04R9/02 ; H01F27/34

Abstract:
An apparatus including a magnet assembly having at least two magnet assembly components; and an eddy current heating reduction system configured to reduce heating of the magnet assembly by magnetic fields. The eddy current heating reduction system includes electrical insulation between the at least two magnet assembly components, and includes at least one of the at least two magnet assembly components having a divided current loop area at least two spaced subsections.
Public/Granted literature
- US20140176058A1 Reducing Inductive Heating Public/Granted day:2014-06-26
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