Invention Grant
- Patent Title: Coil module and electronic apparatus
- Patent Title (中): 线圈模块和电子设备
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Application No.: US14195589Application Date: 2014-03-03
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Publication No.: US09325197B2Publication Date: 2016-04-26
- Inventor: Takanori Hirobe , Yoshio Koyanagi , Hiroyuki Uejima
- Applicant: Panasonic Intellectual Property Corporation of America
- Applicant Address: US CA Torrance
- Assignee: Panasonic Intellectual Property Corporation of America
- Current Assignee: Panasonic Intellectual Property Corporation of America
- Current Assignee Address: US CA Torrance
- Agency: Seed IP Law Group PLLC
- Priority: JP2013-082069 20130410
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H02J7/02 ; H01F38/14 ; H01F27/28 ; H01F27/36

Abstract:
A coil module is disposed inside an electronic apparatus and receives prescribed power. The coil module includes a loop coil, a plate-like magnetic body that is disposed on the loop coil, and a conductive member that has prescribed conductivity and is disposed parallel with the plate-like magnetic body and on a surface, opposite to a surface on which the loop coil is disposed, of the magnetic body. The conductive member projects outward relative to at least a portion of a circumferential surface of the magnetic body.
Public/Granted literature
- US20140306653A1 COIL MODULE AND ELECTRONIC APPARATUS Public/Granted day:2014-10-16
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