Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14012257Application Date: 2013-08-28
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Publication No.: US09325307B2Publication Date: 2016-04-26
- Inventor: Naoya Odagiri
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2012-191082 20120831
- Main IPC: H03K17/16
- IPC: H03K17/16 ; H03K17/64

Abstract:
The semiconductor device includes first and second output terminals each coupled to one end side and another end side of an inductive or capacitive load, a first MOS transistor coupled between a first voltage and the first output terminal, a second MOS transistor coupled between a second voltage and the first output terminal, a third MOS transistor coupled between the first voltage and the second output terminal, a fourth MOS transistor coupled between the second voltage and the second output terminal, and a drive circuit driving the first to fourth MOS transistors for controlling the inductive or capacitive load, and further includes first and second bypass transistors for bypassing a forward current of a parasitic diode of a PN-junction formed in the MOS transistor in the dead-off period.
Public/Granted literature
- US20140062576A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-03-06
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