Invention Grant
- Patent Title: Power supplying module for contactless power supplying device, method for using power supplying module of contactless power supplying device, and method for manufacturing power supplying module of contactless power supplying device
- Patent Title (中): 非接触式供电装置的供电模块，非接触式供电装置的供电模块的使用方法以及非接触供电装置的供电模块的制造方法
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Application No.: US13823975Application Date: 2012-01-11
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Publication No.: US09325386B2Publication Date: 2016-04-26
- Inventor: Hideaki Abe , Hiroyuki Yagyu , Wataru Tanaka , Shinichi Abe
- Applicant: Hideaki Abe , Hiroyuki Yagyu , Wataru Tanaka , Shinichi Abe
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP2011-017018 20110128
- International Application: PCT/JP2012/050353 WO 20120111
- International Announcement: WO2012/102075 WO 20120802
- Main IPC: H02J17/00
- IPC: H02J17/00 ; H04B5/00 ; H05K13/04 ; H01F38/14
Abstract:
Coil units equipped with primary coils having the same specification are provided in a power feeding module. Coil-unit intermeshing recess sections are formed on a printed circuit board to match each of the coil units. Pads for joining together with electrodes formed on the coil units are formed on the bottom faces of each of the coil-unit intermeshing recess sections. A plurality of coil units can be mounted onto the printed circuit board easily, by fitting each of the coil units into each of the coil-unit intermeshing recess sections and joining them together, which will enable manufacturing efficiency to be improved.
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