Invention Grant
- Patent Title: Electro-optical transceiver device to enable chip-to-chip interconnection
- Patent Title (中): 电光收发器设备，实现芯片间的互连
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Application No.: US14280270Application Date: 2014-05-16
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Publication No.: US09325420B2Publication Date: 2016-04-26
- Inventor: Kwan-yu Lai , Ravindra Vaman Shenoy , Jitae Kim , Jon Bradley Lasiter , Donald William Kidwell, Jr. , Evgeni Petrovich Gousev
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Toler Law Group, PC
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H04B10/50 ; G02B6/43 ; G02B6/42 ; H03F3/08 ; G01J1/04 ; G02B6/00
Abstract:
An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.
Public/Granted literature
- US20150333831A1 ELECTRO-OPTICAL TRANSCEIVER DEVICE TO ENABLE CHIP-TO-CHIP INTERCONNECTION Public/Granted day:2015-11-19
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