Invention Grant
US09325921B2 Method for manufacturing an imaging apparatus having a frame member covering a pad
有权
一种用于制造具有覆盖垫的框架构件的成像装置的方法
- Patent Title: Method for manufacturing an imaging apparatus having a frame member covering a pad
- Patent Title (中): 一种用于制造具有覆盖垫的框架构件的成像装置的方法
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Application No.: US14677781Application Date: 2015-04-02
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Publication No.: US09325921B2Publication Date: 2016-04-26
- Inventor: Yasuhiro Kamada
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2011-085328 20110407
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N5/369 ; H01L27/146

Abstract:
A solid-state imaging apparatus includes: a solid-state imaging device mounted on a substrate; a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate; a frame member that has a frame-like shape and surrounds side portions of the solid-state imaging device; and a light-transmissive optical member so accommodated in the frame member that the optical member faces an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion extending from the side where the optical member is present toward the imaging surface, and the frame member is integrally fixed to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion.
Public/Granted literature
- US20150215551A1 SOLID-STATE IMAGING APPARATUS, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM Public/Granted day:2015-07-30
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