Invention Grant
- Patent Title: Sound transducer acoustic back cavity system
- Patent Title (中): 声音传声器回声腔系统
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Application No.: US14419241Application Date: 2012-08-13
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Publication No.: US09326054B2Publication Date: 2016-04-26
- Inventor: Shengrong Shi
- Applicant: Shengrong Shi
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- International Application: PCT/CN2012/080043 WO 20120813
- International Announcement: WO2014/026318 WO 20140220
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04M1/03 ; H04R1/28 ; H04R31/00
Abstract:
An apparatus including a housing member and an airflow spreader. The housing member includes an acoustic back cavity for a sound transducer and at least two second cavities in the housing member spaced from the acoustic back cavity. The airflow spreader is connected to the housing member. The airflow spreader includes a conduit system connecting the acoustic back cavity directly with each of the at least two second cavities through the airflow spreader.
Public/Granted literature
- US20150189412A1 SOUND TRANSDUCER ACOUSTIC BACK CAVITY SYSTEM Public/Granted day:2015-07-02
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