Invention Grant
- Patent Title: Aluminum nitride substrate
- Patent Title (中): 氮化铝基板
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Application No.: US14680719Application Date: 2015-04-07
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Publication No.: US09326373B2Publication Date: 2016-04-26
- Inventor: Henry Meyer Daghighian , Steven C. Bird
- Applicant: Finisar Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: FINISAR CORPORATION
- Current Assignee: FINISAR CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H05K1/02 ; H05K1/03 ; H05K1/11 ; G02B6/132 ; G02B6/124 ; G02B6/122
Abstract:
A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.
Public/Granted literature
- US20150296610A1 ALUMINUM NITRIDE SUBSTRATE Public/Granted day:2015-10-15
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