An electrical connector for electrically connecting a first electronic element having protruding conductive portions in the bottom thereof to a second electronic element, includes an insulating body located below the first and above the second electronic element, a conductor, a solder pad disposed on the lower surface of the insulating body, and a conducting line disposed in the insulating body and conducting the conductor and the solder pad. Upper surface of the insulating body has accommodation holes. Aperture of the accommodation hole is greater than outer diameter of the conductive portion. Wall and bottom of the accommodation holes form the conductor. The accommodation hole has low-melting point liquid metal conductor. When the conductive portion enters the accommodation hole, the liquid metal adheres to the conductive portion, and forms a conductive path between the conductive portion and the conductor. A manufacturing method of the electrical connector.