Invention Grant
- Patent Title: Waterproof cap for ports in electronic devices
- Patent Title (中): 电子设备端口防水盖
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Application No.: US14509916Application Date: 2014-10-08
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Publication No.: US09326403B2Publication Date: 2016-04-26
- Inventor: Xiang-Hong Xie , Lin-Zhi Duan , Deng-Lai Ke
- Applicant: AMBIT MICROSYSTEMS (SHANGHAI) LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Shanghai TW New Taipei
- Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Shanghai TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201410064040 20140226
- Main IPC: H05K5/02
- IPC: H05K5/02 ; G06F1/16 ; H04M1/02

Abstract:
A waterproof cap for electronic devices includes a cover plate and sealing base located on a surface of the cover plate for sealing a port of a housing of the electronic devices. A first lip and a second lip are located on an outer periphery of the sealing base and are spaced apart from each other. The first lip is located between the cover plate and the second lip. When the sealing base is inserted into the port of the housing of the electronic devices, the first lip is configured to tilt toward the cover plate, and the second lip is configured to tilt away from the cover plate.
Public/Granted literature
- US20150245512A1 WATERPROOF CAP FOR PORTS IN ELECTRONIC DEVICES Public/Granted day:2015-08-27
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