Techniques for computing device cooling using a self-pumping cooling fluid are described. For example, an apparatus may comprise one or more heat-generating components, a housing forming a cavity including the one or more heat-generating components, and a self-pumping cooling fluid arranged in the cavity. The self-pumping cooling fluid may comprise a slurry of microencapsulated phase change material (mPCM) particles suspended in a working fluid and arranged to circulate throughout the cavity. Other embodiments are described.